SMD Sim.
Total Processes
8
Bottleneck
3
Avg Utilization
86.6%
Max Utilization
138.9%
Capa Simulation
| Process | Equipment | Cycle Time (s) | Setup (min) | Capa/Hr | Required | Utilization | Status |
|---|---|---|---|---|---|---|---|
| DEK Horizon 03iX | 12.5 | 15 | 288 | 250 | 86.8% | OK | |
| Chip-Mount | Samsung SM482+ | 8.2 | 20 | 439 | 250 | 56.9% | OK |
| Chip-Mount | Samsung SM482+ | 8.5 | 20 | 424 | 250 | 59% | OK |
| Shieldcan | Custom Shield | 15 | 10 | 240 | 250 | 104.2% | Bottleneck |
| Test | ICT Tester V2 | 18 | 5 | 200 | 250 | 125% | Bottleneck |
| Underfill | Nordson EFD | 10 | 12 | 360 | 250 | 69.4% | OK |
| Tape | Auto Taping M1 | 6 | 8 | 600 | 250 | 41.7% | OK |
| TIM | Dispensing TIM | 14 | 10 | 257 | 250 | 97.3% | OK |
| Router | CNC Router V3 | 20 | 15 | 180 | 250 | 138.9% | Bottleneck |
New Material Information
| Part No. | Part Name | Supplier | Spec | Qty |
|---|---|---|---|---|
| PCB-TOP-938 | Main PCB Top | Samsung SDI | 120x65mm FR4 | 1 |
| IC-AP-001 | AP Chip (Exynos) | Samsung LSI | BGA 14x14mm | 1 |
| IC-MEM-001 | Memory (LPDDR5) | Samsung MEM | PoP 12x12mm | 1 |
| MLCC-0402 | Capacitor 0402 | Samsung EM | 0.4x0.2mm 10uF | 185 |
| RES-0201 | Resistor 0201 | Samsung EM | 0.2x0.1mm 10K | 92 |
| SHIELD-001 | EMI Shield Can | Laird | SUS304 0.1t | 3 |
| CONN-USB | USB Type-C | JAE | 24pin USB3.1 | 1 |
| ANT-5G | 5G Antenna | Amphenol | mmWave 28GHz | 4 |